Linx

How to Use the LC Series LINX Modules

by Lee Rumsey

These are basic instructions on hooking up the modules. This document is split into five nifty sections:

For data sheets on the LINX modules, see this web site: http://www.linxtechnologies.com. Click on the RF Modules link. Then click on the Manuals item under the LC Series heading. READ through the LC Series data sheets to get an understanding of their function. This will reduce the likelihood of errors.

Necessary Parts

TX board (1) Smaller PC board; has TXM-XXX-LC chip on it
RX board (1) Larger PC board; has RXM-XXX-LC chip on it
Antenna (2) Either whips or helical antennas
RG-174 50W coax cable Available from ECE Store; for connecting antennas
22 ga hookup wire Should be laying around the 445 lab
390 W, 1/4 W resistor (1) Needed for 5V operation

Before we start

  1. Learn to solder. You will be making some delicate connections, so practice if you don't know how. Also be sure to use solder sparingly- big blobs will likely result in damage or malfunctions.
  2. You should have the parts listed above. Get them from a TA.
  3. Make sure the transmitter and receiver are running on the same frequency. Do this by checking the model number on the surface mount package. For example, a 418 MHz TX module will be labeled TXM-418-LC, and a 315 MHz RX module will be RXM-315-LC.

Transmitter Assembly

The LINX transmitter is the smaller of the two modules. It runs on between +2.7 and 5.2 VDC. We will use a +5 VDC power supply, so that the data input can be a TTL level signal. DO NOT apply a voltage greater than Vcc on the data input pin!

Step 1. Acclimate yourself with the circuit we are building:
schematic

Step 2. Place the TX board with chip side facing UP. The writing on the chip should be right side up, with a little wire coming off the top. This wire is GROUND. A '1' or a small dot should be visible on the lower left-hand corner of the chip. GROUND is also connected to the center bus strip on the board.

Step 3. Solder the 390 W resistor from pin 4 (lower right-hand corner) to ground. This sets the chip to accept 5 VDC. NOTE: make all connections on the top of the board. DON'T feed any leads through the holes. There are connections on the other side!

Step 4. Carefully solder a 3-inch wire to pin 2. This will be the DATA input. DO NOT apply a voltage greater than Vcc on the data input pin!

Step 5. Carefully solder a 3-inch wire to pin 7. This will be the VCC power input. REMEMBER: +5 VDC ONLY on this pin!

Step 6a. If you have a HELICAL COIL antenna, solder a short (2 inch) length of coax cable to pin 5 and GROUND. The inner conductor is the RF signal, and the outer shield goes to GROUND. Now solder the helical coil to the other end of the coax to form a magnetic loop. (You may need to extend the shield connection with a separate wire.)

Step 6b. If you have a WHIP antenna, solder the coax cable directly to pin 5 and GROUND. The inner conductor is the RF signal, and the outer shield goes to GROUND.

Here is the completed TX board assembly:
board


Receiver Assembly

The LINX receiver is the larger of the two modules. It runs on between +4 and 5.2 VDC. We will use a +5 VDC power supply. GROUND is the center vertical strip on the solder side.

Step 1. Acclimate yourself with the circuit we are building:
circuit

Step 2. Place the RX board with chip side facing DOWN, with the solder side UP. Orient the board so that one wire comes off the top, while another comes off the left of the board. The top wire is the power connection; the left wire is ground. Pin 1 of the chip is actually at the lower left with this orientation; it is identified on the chip by a '1' or a dot.

Step 3. Carefully solder a 3-inch wire to pin 5 (top left solder pad connected to the chip). This will be the DATA output.

Step 4a. If you have a HELICAL COIL antenna, solder a short (2 inch) length of coax cable to pin 1 and GROUND. The inner conductor is the RF signal, and the outer shield goes to GROUND. Now solder the helical coil to the other end of the coax to form a magnetic loop. (You may need to extend the shield connection with a separate wire.)

Step 4b. If you have a WHIP antenna, solder the coax cable directly to pin 1 and GROUND. The inner conductor is the RF signal, and the outer shield goes to GROUND.

Step 5. IMPORTANT! If there is a connection to pin 10 on the Linx chip, carefully desolder it, leaving the others intact. It is misconnected.

Here is the completed RX board assembly:
complete


Testing and Operation

Now we'll see if these modules work. If you are working with 418 MHz chips, then a reference receiver - transmitter pair are available for testing. Otherwise, you better hope you made the right connections? we don't have anything to test the 315 MHz RX/TX chips, except maybe another functioning pair of modules.

Step 1. TESTING THE TRANSMITTER. Refer to the schematic for the TX module we just assembled. Connect +5 VDC to the power lead, and ground the GROUND lead.

Step 2. Turn on or plug in the power. Use +5 VDC only! If anything is heating up, UNPLUG the module and check your connections!

Step 3. Set up a function generator the make a 1 kHz TTL compatible square wave (i.e. it swings between 0 and +5V only!) Connect this signal to the data input lead from the module. If anything is heating up, UNPLUG the module and check your connections!

Step 4. Plug the data output of the reference receiver into an oscilloscope. ASK A TA FOR ASSISTANCE! If all is well, a 1 kHz square wave should appear on the screen. You are done; wire your module into the rest of your circuit.

NOTE: For a flaky power supply, a bypass capacitor (10 uF electrolytic) may be necessary between power and ground on YOUR board.

Step 5. TESTING THE RECEIVER. Refer to the schematic for the RX module we just assembled. Connect +5 VDC to the power lead, and ground the GROUND lead

Step 6. Turn on or plug in the power. Use +5 VDC only! If anything is heating up, UNPLUG the module and check your connections!

Step 7. Set up a function generator the make a 1 kHz TTL compatible square wave (i.e. it swings between 0 and +5V only!) Connect this signal to the data input on the reference transmitter. ASK A TA FOR ASSISTANCE! If anything is heating up, UNPLUG the module and check your connections!

Step 8. Connect the data output of your receiver module into an oscilloscope. If all is well, a 1 kHz square wave should appear on the screen. You are done; wire your module into the rest of your circuit.

THE END.

ATTITUDE DETERMINATION AND CONTROL MODULE FOR UIUC NANOSATELLITES

Shamith Achanta, Rick Eason, Srikar Nalamalapu

Featured Project

Team Members:

- Rick Eason (reason2)

- Srikar Nalamalapu (svn3)

- Shamith Achanta (shamith2)

# Problem

The Aerospace Engineering department's Laboratory for Advanced Space Systems at Illinois (LASSI) develops nanosatellites for the University of Illinois. Their next-generation satellite architecture is currently in development, however the core bus does not contain an Attitude Determination and Control (ADCS) system.

In order for an ADCS system to be useful to LASSI, the system must be compliant with their modular spacecraft bus architecture.

# Solution

Design, build, and test an IlliniSat-0 spec compliant ADCS module. This requires being able to:

- Sense and process the Earth's weak magnetic field as it passes through the module.

- Sense and process the spacecraft body's <30 dps rotation rate.

- Execute control algorithms to command magnetorquer coil current drivers.

- Drive current through magnetorquer coils.

As well as being compliant to LASSI specification for:

- Mechanical design.

- Electrical power interfaces.

- Serial data interfaces.

- Material properties.

- Serial communications protocol.

# Solution Components

## Sensing

Using the Rohm BM1422AGMV 3-axis magnetometer we can accurately sense 0.042 microTesla per LSB, which gives very good overhead for sensing Earth's field. Furthermore, this sensor is designed for use in wearable electronics as a compass, so it also contains programable low-pass filters. This will reduce MCU processing load.

Using the Bosch BMI270 3-axis gyroscope we can accurately sense rotation rate at between ~16 and ~260 LSB per dps, which gives very good overhead to sense low-rate rotation of the spacecraft body. This sensor also contains a programable low-pass filter, which will help reduce MCU processing load.

Both sensors will communicate over I2C to the MCU.

## Serial Communications

The LASSI spec for this module requires the inclusion of the following serial communications processes:

- CAN-FD

- RS422

- Differential I2C

The CAN-FD interface is provided from the STM-32 MCU through a SN65HVD234-Q1 transceiver. It supports all CAN speeds and is used on all other devices on the CAN bus, providing increased reliability.

The RS422 interface is provided through GPIO from the STM-32 MCU and uses the TI THVD1451 transceiver. RS422 is a twisted-pair differential serial interface that provides high noise rejection and high data rates.

The Differential I2C is provided by a specialized transceiver from NXP, which allows I2C to be used reliably in high-noise and board-to-board situations. The device is the PCA9615.

I2C between the sensors and the MCU is provided by the GPIO on the MCU and does not require a transceiver.

## MCU

The MCU will be an STM32L552, exact variant and package is TBD due to parts availability. This MCU provides significant processing power, good GPIO, and excellent build and development tools. Firmware will be written in either C or Rust, depending on some initial testing.

We have access to debugging and flashing tools that are compatible with this MCU.

## Magnetics Coils and Constant Current Drivers

We are going to wind our own copper wire around coil mandrels to produce magnetorquers that are useful geometries for the device. A 3d printed mandrel will be designed and produced for each of the three coils. We do not believe this to be a significant risk of project failure because the geometries involved are extremely simple and the coil does not need to be extremely precise. Mounting of the coils to the board will be handled by 3d printed clips that we will design. The coils will be soldered into the board through plated through-holes.

Driving the inductors will be the MAX8560 500mA buck converter. This converter allows the MCU to toggle the activity of the individual coils separately through GPIO pins, as well as good soft-start characteristics for the large current draw of the coils.

## Board Design

This project requires significant work in the board layout phase. A 4-layer PCB is anticipated and due to LASSI compliance requirements the board outline, mounting hole placement, part keep-out zones, and a large stack-through connector (Samtec ERM/F-8) are already defined.

Unless constrained by part availability or required for other reasons, all parts will be SMD and will be selected for minimum footprint area.

# Criterion For Success

Success for our project will be broken into several parts:

- Electronics

- Firmware

- Compatibility

Compatibility success is the easiest to test. The device must be compatible with LASSI specifications for IlliniSat-0 modules. This is verifiable through mechanical measurement, board design review, and integration with other test articles.

Firmware success will be determined by meeting the following criteria:

- The capability to initialize, configure, and read accurate data from the IMU sensors. This is a test of I2C interfacing and will be tested using external test equipment in the LASSI lab. (We have approval to use and access to this equipment)

- The capability to control the output states of the magnetorquer coils. This is a test of GPIO interfacing in firmware.

- The capability to move through different control modes, including: IDLE, FAULT, DETUMBLE, SLEW, and TEST. This will be validated through debugger interfacing, as there is no visual indication system on this device to reduce power waste.

- The capability to self-test and to identify faults. This will be validated through debugger interfacing, as there is no visual indication system on this device to reduce power waste.

- The capability to communicate to other modules on the bus over CAN or RS422 using LASSI-compatible serial protocols. This will be validated through the use of external test equipment designed for IlliniSat-0 module testing.

**Note:** the development of the actual detumble and pointing algorithms that will be used in orbital flight fall outside the reasonable scope of electrical engineering as a field. We are explicitly designing this system such that an aerospace engineering team can develop control algorithms and drop them into our firmware stack for use.

Electronics success will be determined through the successful operation of the other criteria, if the board layout is faulty or a part was poorly selected, the system will not work as intended and will fail other tests. Electronics success will also be validated by measuring the current consumption of the device when operating. The device is required not to exceed 2 amps of total current draw from its dedicated power rail at 3.3 volts. This can be verified by observing the benchtop power supply used to run the device in the lab.